Our Team:
Team works on a new product development machine for Lithography step for Advanced packaging. Presently tool we have introduced product at major semiconductor companies and working on next generation platform. Team in India works on core modules and owners for many modules. Team comprises of mechanical, electrical, electronics and software functions and also, we have a proto-lab for concept and feasibility approach.
Work with global team in Santa Clara, Taiwan, Japan and world-wide field customers.
Team was formed last 5+ years, and Total India team size is 25. Team has many accolades and won many teams of the quarter awards. Motto of team is: ‘Alone we can do so little; together we can do so much.’
Your Opportunity:
As PLM Engineer your Roles and Responsibility listed below, and growth would see in T shaped approach with both breadth (Capacity) and Depth (Capability).
Roles and Responsibility:
Experienced Engineer who is aware of general system design, release management, configuration management and overall change management control)
- Owns product change management (PCM) and control
- Unreleased product approval and control
- ECO (Engineering Change Order) approval
- Implementation of PCN (Part Change Notification), with Global Product Support
- Provides guidance/input to Engineering and the Business Unit about the field service impact of part/supplier changes.
- Accuracy of customer shipped configurations and BOMs (Bill of Materials)
- CaRM (Configuration accuracy Review Meeting) reviews
- BOM (Bill of Materials) accuracy
- NSR (Non Standard Request) approval
- Owns common modules roadmap and implementation post Phase 5 of ePLC.
- Implementation of component roadmaps including part obsolescence, replacements, alternative vendors and cost reduction
- Facilitates Intercompany communication to align on product strategies, provide guidance on pricing, spare level contents, and restricted part orders.
- Implementation of cost reduction roadmap
- Manage strategic vendor issues
- Manage all changes to the product after product release whether driven by engineering, quality, safety,
customer demands or supply obsolesce.
Qualifications
- B.Tech. Mechanical Engineering 8-10 years of experience.
- Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines.
- Understands key business drivers; uses this understanding to accomplish own work
- Mechanical engineering experience in component selection, building, testing, troubleshooting, and releasing semiconductor or other similar scale capital equipment.
- Knowledge in SEMI S2/S8/S14, NFPA 79, F47, CE, EMI/EMC safety standards
- Knowledge of 3D CAD design tools (i.e., Inventor) and 2D CAD drawing tools not limited to Nx, Inventor, AutoCAD, etc.
- Working knowledge of materials & components used in semiconductor wafer manufacturing equipment, materials characterization methods, and failure analysis of materials/system.
- Experience with supporting manufacturing and service organizations through training, documentation (procedures, OMS, BKMs, etc.), and troubleshooting.
- Strong communications skills, organizational skills and sense of collaboration.
- Drive and desire to thrive in a start-up like environment.
Qualifications
Education:
Bachelor's Degree
Skills:
Certifications:
Languages:
Years of Experience:
2 - 4 Years
Work Experience:
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
