Introduction As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.
Your Role and Responsibilities We are part of a world-class product development organization that pioneers industry leading hardware designs for IBM POWER Systems servers as well as Storage, Quantum, and IBM Research. Within this organization, The India System design team is seeking a professional with experience in Package Design Electrical Analysis Engineer role. We develop laminate and interconnect products to enable semiconductor packaging for the IBM Product Set This position involves you to work in the development of IBM semiconductor substrate and interconnect solutions used in the server hardware applications Responsibilities The IBM Semiconductor Enablement Team is a highly collaborative group, and its key mission is to support IBM system hardware development including Si substrate and interconnect solutions. This group works closely with packaging development and manufacturing teams, procurement team and directly with our core suppliers to support the group’s overall mission.
Responsible for the next generation laminate and high speed interconnect technology development and qualification, driving supplier quality and technology improvements.
Support laminate design team in the verification of product electrical design to ensure electrical signal integrity and manufacturability.
Responsible for the measurement and modeling of laminate product electrical performance including signal attenuation, reflection, transmission, impedance, cross talk, current carrying capability etc.
Strategically align with packaging development team in the efforts to understand laminate product failures through root cause analysis.
Required Technical and Professional Expertise
Bachelor of Engineering – Electrical or Electronics
10+ years’ experience in high frequency signal integrity in semiconductor package design
Familiar with semiconductor packaging including 2.5D, 3D packaging
Familiar with laminate design (ground rules, materials, electrical layout and cross section…)
Experience in transmission line analysis for IC package
Clear communication abilities.
Preferred Technical and Professional Expertise
MS or PhD in Electrical Engineering with high frequency signal integrity background.
Review and check packaging electrical design before releasing to manufacturing
3 or more years of experience in printed circuit boards and laminate electrical
signal integrity testing and modeling, such as VNA tool.
3 or more years of experience Q2D extractor for board file importing (BRD and/or
MCM file formats).
3 or more years of experience in electromagnetic simulation tools such as HFSS.
