Company:Qualcomm India Private Limited
Job Area:Engineering Group, Engineering Group > Software Engineering
General Summary:
- Automotive Power/Thermal Software products team at Qualcomm to achieve industry leading Power/Thermal/Limit SW management solution on Qualcomm
- Next gen Automotive chipsets.
- In this position, the candidate will be working with cross-functional teams to identify Power optimizations/Perf tuning, thermal/limits
- HW tuning/characterization/risks assessment and provide optimized solutions with proper Mitigation.
- The candidate will need to perform system level analysis of Power/thermal use cases, expected to collaborate with Architecture, HW
- design, Performance, Power/Thermal Systems and various software teams to work towards optimal system level Power/thermal SW solution.
- In addition, the candidate will need to develop tools and methodologies for competitive analysis to learn about competitors strengths
- and weaknesses, and come up with thermal mitigations schemes that are best in the industry.
- Candidate must have fundamental understanding on Linux/Android power management framework.
Minimum Qualifications:
• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
- 1-2 years experience with Programming Language such as C, C++, Java, Python, etc.
- Preferred Qualifications
- Systems/HW background with a good understanding of microprocessor architecture and common SoC hardware blocks (Interconnects, Display Graphics etc.)
- Operating systems concepts - scheduling, memory management, process management, interrupt handling and device drivers
- Using debug tools like JTAG debugger, oscilloscopes, logic analyzers.
- Knowledge on power or Power/thermal management SW development.
- In-depth knowledge in the areas of Embedded Systems, Microcontrollers, SoC Power, Modem, Multimedia, and Wireless communications, System level debugging and analysis for SoC power optimizations.
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